Sunlu 1kg Easy-to-Print Nylon 3D Printer Filament, 1.75mm
Sunlu 1kg Easy-to-Print Nylon 3D Printer Filament, 1.75mm
Sunlu 1kg Easy-to-Print Nylon filament is a durable polyamide (PA) material designed for high-strength 3D printing with a 1.75mm diameter. It is formulated to resist cracking and warping, making it suitable for users who require heat-resistant prints with good mechanical toughness.
Key features
- Mechanical Strength – Offers high tensile strength of 75MPa and flexural strength of 98MPa for durable, long-lasting prints.
- Heat Resistance – Features a heat deflection temperature of 121℃ and vicat softening temperature of 135℃.
- Anti-Warping Formula – Engineered to prevent common issues like cracking and warping during the printing process.
- Wide Compatibility – Designed to work with most FDM 3D printers, including popular models from brands like Bambu Lab, Anycubic, and Elegoo.
- High Precision – Manufactured with a diameter tolerance of ±0.03mm for consistent extrusion performance.
Specifications
| Material | Nylon (PA) |
|---|---|
| Diameter | 1.75mm |
| Net Weight | 1kg |
| Tolerance | ±0.03mm |
| Colors | Natural, Black |
| Printing Temperature | 250–270℃ (at 50–100mm/s), 270–280℃ (at 100–150mm/s) |
| Substrate Temperature | 30–50℃ (glue required) |
| Heat Deflection (HDT) | 121℃ |
| Tensile Strength | 75MPa |
Ideal for
This filament is ideal for functional parts, structural components, and high-temperature prototypes that require durability and impact resistance. It suits makers and engineers using FDM 3D printers who need a stable, heat-resistant alternative to standard filaments.
FAQ
Does it fit my 3D printer?
The filament is 1.75mm in diameter and is designed to be compatible with 99% of FDM printers on the market, including those from brands like Bambu Lab, Anycubic, and Elegoo.
What printing temperature should I use?
Use a temperature range of 250–270℃ for speeds of 50–100mm/s or 270–280℃ for faster printing speeds of 100–150mm/s.
How do I prevent warping during printing?
This filament is designed to be warp-free, but it requires a substrate temperature of 30–50℃ and should be used with glue on the print bed for optimal adhesion.